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Mobile Phone Flex-rigid PCB
Flex-rigid PCB for Universal Remote Control

Flex-rigid PCB for Universal Remote Control

Quick Details

Product Description

Quick Details

Place of Origin:

China

Brand Name:

INNO

Model Number:

Rigid flex PCB

Base Material:

Polyimide,FR4

Copper Thickness:

0.5oz-2oz

Board Thickness:

1.6mm or 0.2-4.0mm, Flex    0.01-0.25mm

Min. Hole Size:

0.01'',0.25mm, or 10mils

Min. Line Width:

0.075mm (3mil)

Min. Line Spacing:

0.075mm (3mil)

Surface Finishing:

Surface Finishing    HASL,Nickle,Immersion Gold,Immersion Tin,Immersion S

Product name:

flex-rigid pcb for universal    remote control

Other name:

rigid-flex pcb board

Copper thickness:

9um / 12um / 18um / 35um

Soldermask Color:

amber (green)

Standard Production layer:

2 layer - 10 Layer

Materials:

Polyimide / FR4

Cover Layer Polyimide:

laser cutting / punching / drilled

Out packing:

according to the customer's    requirement

ID print:

White

Certificate:

ROHS,UL,ISO9001 etc

 

 

Inno Circuit, one of the professional and credible manufacturers and suppliers of PCB, now brings you the best quality flex-rigid pcb for universal remote control at low price. Introducing advanced equipment and employing qualified workers, we have been continuing to innovate. Now, please feel free to check the quotation with us and get the free sample from us.


FAQ

1. What is the method of choosing the inductance and capacitance when filtering?

In addition to considering the frequency of the noise to be filtered out, the inductance value must be selected in consideration of the instantaneous current response capability. If the output of the LC has the opportunity to output a large current instantaneously, then too large an inductance will hinder the speed at which this large current flows through the inductor and increase the ripple noise. The capacitance value is related to the amount of ripple noise specification that can be tolerated. The smaller the ripple noise requirement, the larger the capacitance. The ESR/ESL of the capacitor will also have an effect. In addition, if the LC is placed at the output of a switching regulation power supply, attention should also be paid to the influence of the pole/zero generated by the LC on the stability of the negative feedback control loop. .

2. How to achieve EMC requirements as much as possible without causing too much cost pressure?

The increased cost of PCBs due to EMC is usually due to the increase in the number of layers to enhance the shielding effect and increased ferrite bead, choke, etc., to suppress high-frequency harmonic components. In addition, it is usually necessary to use shield structures on other organizations to enable the entire system to pass EMC requirements. The following provides only a few PCB design techniques to reduce the effect of electromagnetic radiation generated by the circuit.

1) Use a device with a slow slew rate as much as possible to reduce the high frequency components generated by the signal. 2) Pay attention to the position of the high-frequency device, not too close to the external connector. 3) Pay attention to the impedance matching of the high-speed signal, the trace layer and its return current path to reduce high frequency reflection and radiation. 4) Place adequate and appropriate decoupling capacitors on the power pins of each device to mitigate noise on the power and ground planes. Pay special attention to whether the frequency response and temperature characteristics of the capacitor meet the design requirements. 5) The ground near the external connector can be properly segmented and the ground of the connector can be connected to the chassis ground. 6), can be properly used ground guard / shunt traces next to some particularly high-speed signals. However, pay attention to the effect of guard/shunt traces on the characteristic impedance of the trace. 7) The power layer is reduced by 20H than the formation, and H is the distance between the power layer and the formation.

3. When there are multiple digital/analog functional blocks in a PCB, the conventional practice is to separate the digital/analog modules. What are the reasons?

The reason for separating the digital/analog is because the digital circuit generates noise at the power supply and the ground when the high and low voltages are switched. The magnitude of the noise is related to the speed and current of the signal. If the ground plane is not divided and the noise generated by the digital area circuit is large and the circuit of the analog area is very close, even if the digital-to-analog signals do not cross, the simulated signal will still be disturbed by the ground noise. In other words, the digital-to-analog non-divided method can only be used when the analog circuit area is far away from the area of the digital circuit that generates large noise.


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