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Mobile Phone Flex-rigid PCB
Mobile Phone Flex-rigid Board

Mobile Phone Flex-rigid Board

Quick Details

Product Description

Quick Details

Place of Origin:

China

Brand Name:

INNO

Model Number:

0016

Base Material:

Polyimide,FR4

Copper Thickness:

0.5oz-2oz

Board Thickness:

1.6mm or 0.2-4.0mm, Flex    0.01-0.25mm

Min. Hole Size:

0.01'',0.25mm, or 10mils

Min. Line Width:

0.075mm (3mil)

Min. Line Spacing:

0.075mm (3mil)

Surface Finishing:

Surface Finishing    HASL,Nickle,Immersion Gold,Immersion Tin,Immersion S

Product name:

flex-rigid pcb for universal    remote control

Other name:

rigid-flex pcb board

Copper thickness:

9um / 12um / 18um / 35um

Soldermask Color:

amber (green)

Standard Production layer:

2 layer - 10 Layer

Materials:

Polyimide / FR4

Cover Layer Polyimide:

laser cutting / punching / drilled

Out packing:

according to the customer's    requirement

ID print:

White

Certificate:

ROHS,UL,ISO9001 etc

 

 

Inno Circuit, one of the professional and credible manufacturers and suppliers of PCB, now brings you the best quality mobile phone flex-rigid board at low price. Introducing advanced equipment and employing qualified workers, we have been continuing to innovate. Now, please feel free to check the quotation with us and get the free sample from us.


FAQ

1, circuit board DEBUG should start from several aspects?

As far as digital circuits are concerned, we first determine three things in order:

Verify that all power values are within design. Some systems with multiple power supplies may require some sort of ordering and speed between certain power supplies.

Verify that all clock signal frequencies are working properly and there are no non-monotonic issues on the signal edges.

Check if the reset signal meets the specifications.

If these are normal, the chip should send the first cycle signal. Then follow the system operation principle and bus protocol to debug.

2. In the case of a fixed circuit board size, if the design needs to accommodate more functions, it is often necessary to increase the PCB trace density, but this may lead to increased mutual interference of the traces, and at the same time the traces are too thin to make the impedance Can not be reduced, please introduce the high-speed (>100MHz) high-density PCB design skills?

When designing high-speed, high-density PCBs, crosstalk interference really needs special attention because it has a great influence on timing and signal integrity. The following provides several points of attention: 1). Control the continuity and matching of the characteristic impedance of the trace. 2). Size of trace spacing. It is generally seen that the spacing is twice the line width. The effect of trace spacing on timing and signal integrity can be known through simulation to find the tolerable minimum spacing. The result of different chip signals may be different. 3). Select the appropriate termination method. 4). Avoid the same direction of the two upper and lower layers. Even the traces are just overlapping one another, because this crosstalk is larger than the adjacent traces in the same layer. 5). Use blind/buried vias to increase trace area. However, the cost of manufacturing PCB boards will increase.

It is indeed difficult to achieve full parallelism and equal length in actual execution, but it is still necessary to do so. In addition, differential termination and common-mode termination can be reserved to mitigate the impact on timing and signal integrity.

3, the filter at the analog power supply is often an LC circuit. But why is LC sometimes worse than RC filtering?

The comparison of the LC and RC filtering effects must take into account whether the choice of frequency bands and inductance values to be filtered out is appropriate. Because the inductor's reactance size is related to the inductance value and frequency. If the noise frequency of the power supply is low and the inductance value is not large enough, the filtering effect may not be as good as RC. However, the cost of using RC filtering is that the resistor itself consumes energy, has poor efficiency, and pays attention to the power that the selected resistor can withstand.


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