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Mobile Phone Flex-rigid PCB
Multi-layers-FPC-Mobile

Multi-layers-FPC-Mobile

Quick Details

Product Description

Quick Details

Place of Origin:

China

Brand Name:

INNO

Model Number:

0017

Base Material:

Polyimide,FR4

Copper Thickness:

0.5oz-2oz

Board Thickness:

1.6mm or 0.2-4.0mm, Flex    0.01-0.25mm

Min. Hole Size:

0.01'',0.25mm, or 10mils

Min. Line Width:

0.075mm (3mil)

Min. Line Spacing:

0.075mm (3mil)

Surface Finishing:

Surface Finishing    HASL,Nickle,Immersion Gold,Immersion Tin,Immersion S

Product name:

flex-rigid pcb for universal    remote control

Other name:

rigid-flex pcb board

Copper thickness:

9um / 12um / 18um / 35um

Soldermask Color:

amber (green)

Standard Production layer:

2 layer - 10 Layer

Materials:

Polyimide / FR4

Cover Layer Polyimide:

laser cutting / punching / drilled

Out packing:

according to the customer's    requirement

ID print:

White

Certificate:

ROHS,UL,ISO9001 etc

 

 

Inno Circuit, one of the professional and credible manufacturers and suppliers of PCB, now brings you the best quality multi-layers-fpc-mobile at low price. Introducing advanced equipment and employing qualified workers, we have been continuing to innovate. Now, please feel free to check the quotation with us and get the free sample from us.


FAQ

1. When designing high-speed PCBs, designers should consider EMC and EMI rules from those aspects.

In the general EMI/EMC design, it is necessary to consider both radiated and conducted. The former belongs to the higher frequency part (>30MHz) and the latter to the lower frequency part (<30MHz). Only pay attention to the high frequency and ignore the low frequency part. A good EMI/EMC design must take into account the location of the device, the placement of the PCB stack, the important online methods, the choice of devices, etc., if these are not prior arrangements, and then resolve afterwards. Doing things by half will increase the cost. For example, the position of the clock generator should not be as close as possible to the external connector. The high-speed signal should go as far as possible to the inner layer and pay attention to the matching of the characteristic impedance and the reference layer to reduce the reflection. The slope of the signal pushed by the device (slew rate) ) Minimize high-frequency components as much as possible. When decoupling/bypass capacitors are selected, note that their frequency response meets requirements to reduce noise in the power plane. Also, note that the return path of the high-frequency signal current minimizes the loop area (also The loop impedance is minimized to reduce the radiation. It is also possible to split the formation to control the range of high-frequency noise. Finally, select the appropriate chassis ground for the PCB and the housing.

2, how to choose EDA tools?

In the current pcb design software, thermal analysis is not a strong item, so it is not recommended. Other features 1.3.4 can choose PADS or Cadence performance price ratios are good. PLD design beginners can use the integrated environment provided by PLD chip manufacturers, and can use single-point tools when designing more than one million gates.

3. Please recommend an EDA software that is suitable for high-speed signal processing and transmission.

The conventional circuit design, INNOVEDA's PADS is very good, and there are simulation software used with it, and this type of design often occupies 70% of the application. In doing high-speed circuit design, analog and digital hybrid circuits, using Cadence's solution should be a good performance and price of software, of course, Mentor's performance is still very good, especially its design process management should be the best.


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