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Multilayers Layers HDI
10 Layers HDI PCB with ENIG

10 Layers HDI PCB with ENIG

Quick Details

Product Description

Quick Details

Number of Layers:

10-Layer

Base Material:

FR_4 ShengYi

Copper Thickness:

1oz

Board Thickness:

1.6

Min. Hole Size:

0.15mm

Min. Line Width:

4mil

Min. Line Spacing:

4mil

Surface Finishing:

ENIG2u”

Minimum Order Quantity:

NO MOQ

 

Soldermask

Green

Quantity

IPC2

Quick-turn service with prototype

48 hours

 

Logistics

Fedex

Certificate

UL,ISO

 

 

Inno Circuit, one of the professional and credible manufacturers and suppliers of PCB, now brings you the best quality 10 layers hdi pcb with enig at low price. Introducing advanced equipment and employing qualified workers, we have been continuing to innovate. Now, please feel free to check the quotation with us and get the free sample from us.


FAQ

1. In high-speed PCB design, the blank area of the signal layer can be covered with copper, and how should the copper layers of signal layers be distributed on the ground and the power supply?

In general, copper in the blank area is grounded. It is only necessary to pay attention to the distance between the copper and the signal line when applying copper next to the high-speed signal line, because the deposited copper will reduce the characteristic impedance of the trace. Also be careful not to affect the characteristic impedance of its layer, for example in the structure of a dual stripline.

1. Is it possible to use the microstrip line model to calculate the characteristic impedance of the signal line above the power plane? Can the signal between the power supply and the ground plane be calculated using the stripline model?

Yes, both the power plane and the ground plane must be considered as the reference plane when calculating the characteristic impedance. For example, a four-layer board: top-power layer, ground layer, and bottom layer. In this case, the model of the top layer trace characteristic impedance is a microstrip line model with the power plane as a reference plane.

1. Is it possible to automatically generate test points on high-density printed boards through software? Can test requirements for high-volume production be met under normal circumstances?

The general software automatically generates whether the test point satisfies the test requirement. It must see whether the specification of the plus test point meets the requirements of the test tool. In addition, if the traces are too dense and the specifications of the test points are strict, there may be no way to automatically add test points to each line. Of course, you need to manually fill in the place to be tested.


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