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Multilayers Layers HDI
12 Layers PCB with BGA

12 Layers PCB with BGA

Product Description

Number of Layers:

12-Layer

Base Material:

FR_4

Copper Thickness:

1oz

Board Thickness:

1.6

Min. Hole Size:

8mil

Min. Line Width:

5mil

Min. Line Spacing:

5mil

Surface Finishing:

ENIG

Minimum Order Quantity:

NO MOQ

 

Soldermask

Green

Quantity

IPC2

Quick-turn service with prototype

96 hours

 

Logistics

DHL

Certificate

UL

 

 

Inno Circuit, one of the professional and credible manufacturers and suppliers of PCB, now brings you the best quality 12 layers pcb with bga at low price. Introducing advanced equipment and employing qualified workers, we have been continuing to innovate. Now, please feel free to check the quotation with us and get the free sample from us.


FAQ

1, adding test points will not affect the quality of high-speed signals?

Whether it will affect the signal quality depends on how quickly the test point is added and how fast the signal is. Basically added test points (do not use via or DIP pins as test points) may be added to the line or pulled from the line. The former is equivalent to adding a very small capacitor on the line, the latter is more than a branch. Both of these conditions will have some effect on the high-speed signal more or less. The degree of the influence is related to the frequency speed of the signal and the edge rate of the signal. The size of the effect can be known through simulation. In principle, the smaller the test point, the better (of course, to meet the test equipment requirements) The shorter the branch, the better.

2, a number of PCB composition system, the ground between the boards should be how to connect?

When the signal or power source between each PCB board is connected to each other, for example, A board has power or signal sent to board B, there must be an equal amount of current flowing from the ground back to board A (this is the Kirchoff current law). The electrical current in this formation will find its place where the impedance is the smallest. Therefore, the number of pins assigned to the ground must not be too low at each interface, whether it is a power supply or a signal interconnect, in order to reduce the impedance, which can reduce the noise in the formation. In addition, it is also possible to analyze the entire current loop, especially the part where the current is larger, and adjust the ground or ground connection to control the current flow (for example, to make a low impedance somewhere and let most of the current flow from this Go away) to reduce the impact on other more sensitive signals.

3, two often referred to the characteristic impedance formula:

a. Microstrip

Z={87/[sqrt(Er+1.41)]}ln[5.98H/(0.8W+T)] where W is the line width, T is the copper thickness of the trace, and H is the trace to the reference plane. Distance, Er is the dielectric constant of the PCB material. This formula must be applied when 0.1<(W/H)<2.0 and 1<(Er)<15.

b. stripline

Z=[60/sqrt(Er)]ln{4H/[0.67π(T+0.8W)]} where H is the distance between two reference planes and the trace is located in the middle of the two reference planes. This formula must be applied when W/H<0.35 and T/H<0.25.


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