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Analysis of Printed Circuit Board Industry Development

Shenzhen Inno Circuit Co.,Ltd | Updated: Sep 27, 2016

    The current circuit board, mainly by the lines and graphics, dielectric layer, holes, solder resist ink, silk screen and surface treatment of several major components. Line is used as the original between the tools, in the design will be designed as a large copper ground and power layer, lines and graphics are often made at the same time. Dielectric layer used to maintain the insulation between the lines and layers, commonly known as the substrate. The vias allow more than two layers of the circuit to turn on each other, the larger holes are used as part inserts, and the other non-conductive hole is usually used as a surface mount positioning, assembly screws. Solder ink is mainly used for permanent protection of printed circuit board on the line, to prevent oxidation of the line, as a result of accidental cleansing open or short circuit problems. According to different processes, solderable ink can be divided into green oil, red oil, blue oil. Silk screen is not necessary to form, the main function is marked on the circuit board parts of the name, location box, easy to use after assembly and identification. Finally, the copper surface in the general environment is very easy to oxidation, resulting in tin (tin poor), it will eat tin copper surface protection. Protection methods are sprayed tin, gold, silver, tin, organic flux, etc., each with advantages and disadvantages, collectively referred to as surface treatment.