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Circuit board four plating methods

Shenzhen Inno Circuit Co.,Ltd | Updated: Sep 27, 2016

1, finger-row plating equipment

In electroplating, it is often necessary to deposit rare metals on the board edge connector, on the board side tabs or on the cheat fingers to provide a lower contact resistance and a higher resistance to wear, a technique known as finger row plating or protruding portion plating .

In the electroplating are also often plated in the inner layer of the nickel plating of the board edge connector prominent contacts, finger or edge of the protruding part of the manual or automatic plating technology, the current contact with the gold-plated plug or gold finger has been plated Lead, plated button replaced.

2, through-hole plating

There are a number of ways to create a desirable plating layer on the hole walls of the substrate drilled in through-hole plating, which is known as pore-wall activation in industrial applications. The printed circuit commercial production process requires a number of intermediate storage tank, each tank has its own control and maintenance requirements.

Through-hole electroplating is a necessary post-production process for the drilling process. When the drill bit is drilled through the copper foil and the substrate below it, the heat generated melts and melts the insulating synthetic resin, which constitutes most of the substrate body, and other drilling debris Deposited around the holes, and applied to the newly exposed wall of the copper foil.