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Manufacturing difficulties of double-sided aluminum substrate

Shenzhen Inno Circuit Co.,Ltd | Updated: Sep 27, 2016


(1) oxidation of aluminum: strong to oil cleaning (sodium hydroxide) ----- dilute nitric acid and ----- coarsening (aluminum plate surface honeycomb) ----- oxidation (3UM) - ---- Acid and alkali sealing ------ ------ baking. Each process must ensure that the quality of aluminum substrate adhesion otherwise.

(2) the entire production process not allowed to scratch the aluminum surface, not hand-touch aluminum, moisture and any other pollution, or affect the aluminum substrate adhesion.

(3) aluminum substrate insulation must be kept clean, dry, small impurities affect its pressure resistance, moisture easily lead to stratification.

(4) to be affixed to the protective film formation, there is no gap, air bubbles, or in the circuit board caused by aluminum corrosion in the process of discoloration, black.


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