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On PCB cooling strategy

Shenzhen Inno Circuit Co.,Ltd | Updated: May 25, 2018

On PCB cooling strategy


With the development of the communications and information technology industries and people’s increasing demand for information, many chip manufacturers have racked their brains to improve the computing power and storage capacity of the chips and enhance the diversity of products. The purpose is to provide customers with unique services. For example, Huawei's Kirin 970 processor and Apple's A11 processor, just listed, will undoubtedly bring a wonderful experience to customers. However, when the chip is running, especially during high-speed operation, a large amount of heat is generated, so that the internal temperature of the mobile phone is rapidly increased. If the heat is not timely and effectively dissipated, the internal parts of the mobile phone will be invalid due to overheating, and the reliability will be reduced. If you do not handle it well, you must repeat the mistakes of Samsung mobile phones. Therefore, it is very important to heat dissipate the mobile phone PCB. Not just mobile phones, but also other electronic products.


Thermal design in the traditional sense is to fully cool electronic equipment through corresponding technical means, structural patterns, and design techniques to meet the reliability and service life requirements. With the ever-increasing performance of communications and information products and the ever-increasing requirements for the portability and miniaturization of communications and information equipment, the power consumption of information equipment continues to increase, while the volume tends to decrease, and the device density per unit area increases. High, then the demand for high heat flux heat dissipation becomes more and more urgent, and thermal design will face enormous challenges. Each electronic product has a set of thermal design solutions for its own products. From the early stage design, device selection, PCB design, to final assembly and packaging, each step has a corresponding heat treatment method. This requires thermal design engineers to use their theoretical knowledge combined with practical work experience to develop a reasonable thermal design.