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PCBA detailed process

Shenzhen Inno Circuit Co.,Ltd | Updated: May 29, 2018

PCBA detailed process

PCBA process is very complex, basically going through nearly 50 procedures, from the circuit board process, component procurement and inspection, SMT chip assembly, DIP plug-in, PCBA testing, program firing, packaging and other important processes. Among them, the circuit board process has 20 to 30 processes, and the procedure is extremely complicated.

Circuit board processing technology and equipment

Circuit board equipment includes electroplating wire, sinker wire, DES wire, SES wire, washer, OSP wire, sink nickel wire, press, exposure machine, oven, AOI, screeding machine, edger, and cutting Machines, vacuum packaging machines, boring machines, drilling rigs, air compressors, spray guns, CMI series, light drawing machines, etc.

The circuit board can be divided into single-sided, double-sided, and multi-layer printed boards according to the number of conductor patterns. The single-sided basic manufacturing process flow is as follows:

Foil--> blanking--> baking sheet (preventing deformation)--> molding--> washing, drying--> foil (or screen printing)->exposure development (or anti-corrosion ink)- -> Etching -> Defilming -> Electrical continuity test -> Cleaning process -> Screen printing solder mask pattern (oil) -> Curing -> Screen printing mark symbol -> Curing - -> Drilling -> Forming -> Cleaning and Drying -> Inspection -> Packaging -> Finished Product.


The basic manufacturing process for a double panel is as follows:

Graphic plating process

Foil--> blanking-> Drilling reference hole--> CNC drilling--> Inspection--> Deburring--> Electroless plating of thin copper--> Electroplated thin copper--> Inspection--> Brush plate -> Foil (or screen printing) -> Exposure development (or curing) -> Inspection repair plate ----> Pattern plating (Cn ten Sn/Pb) -> Defilming -> Etching - -> Inspection plate-->Plug nickel-plated plating-->Hot-melt cleaning-->Electrical continuity inspection-->Cleaning process-->Screen printing resist pattern-->Curing-->Screen printing symbol- -> Curing -> Shape Processing -> Wash Dry -> Inspection -> Packaging -> Finished Products.


The main advantage of the SMOBC process is that it solves the problem of solder bridging and short-circuiting between the thin lines. At the same time, due to the constant lead-tin ratio, it has better solderability and storage than the hot melt plate. The SMOBC process of retreating lead-tin from the pattern plating process is similar to the pattern plating process. Only changes after etching. Double-sided copper clad plate--> According to the pattern electroplating process to the etching process-->Lead lead-->Check---->Cleaning--->Welding resist pattern-->Plug nickel plating gold--> Plug-adhesive tape-->Hot air leveling---->Cleaning--->Screen printing mark symbol--->Outline processing--->Cleaning and drying--->Product inspection-->Packaging-->finished product.


SMT processing technology


1. According to the customer Gerber file and bill of materials, production SMT production process files, generate SMT coordinates file

2. Check whether all the production materials are available, make a uniform slip, and confirm the PMC plan for production.

3. SMT programming, and make the first board to check to ensure that there is no mistake

4. According to SMT process, making laser steel mesh

5. Solder paste printing to ensure uniform paste after printing, good thickness and consistency

6. Mount the components on the circuit board through the SMT placement machine, and perform on-line AOI automatic optical inspection when necessary

7. Set a perfect reflow oven temperature curve, let the circuit board flow through the reflow solder paste, paste from the paste, liquid to solid state conversion, cooling can be achieved after a good welding

8. After the necessary IPQC inspection

9. DIP plug-in process inserts plug-in material through the circuit board and then flows through wave soldering for soldering

10. The necessary after-baking processes, such as cutting feet, post-welding, board cleaning, etc.

11.QA conducts a full inspection to ensure the quality is OK


PCBA test


PCBA tests the most critical quality control process in the entire PCBA manufacturing process. It strictly follows the PCBA test standard and tests the test points of the circuit board according to the customer's test plan.

The PCBA test also includes five main forms: ICT testing, FCT testing, aging testing, fatigue testing, testing in harsh environments.

Among them, the ICT (In Circuit Test) test mainly includes the on-off of the circuit, voltage and current values and fluctuation curves, amplitude, noise, and the like;