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Soft and hard board introduction

Shenzhen Inno Circuit Co.,Ltd | Updated: Jun 01, 2018

Soft and hard board introduction


1. What is a hard and soft board?


The birth and development of FPC (soft board) and PCB (hard board) gave birth to the new product of soft-hard board. Therefore, the soft and hard bonded board is a flexible circuit board and a rigid circuit board. After the laminating and other processes are performed, the circuit board with the characteristics of the FPC and the characteristics of the PCB is formed in accordance with the relevant process requirements.




2. Application area


Soft and hard integrated boards are widely used, such as: iPhone and other high-end smart phones; high-end Bluetooth headsets (required for signal transmission distance); smart wearable devices; robots; drones; curved display; high-end industrial control equipment; aerospace satellites and other fields Can see its figure. With the development of smart devices that are becoming more highly integrated, lightweight, and miniaturized, and the new requirements put forth by Industry 4.0 for personalized production. With its excellent physical properties, hard-soft boards can certainly shine in the near future.


3. The advantages and disadvantages of the hard and soft combination


Advantages: It has excellent features of both PCB and FPC. It can not only fold, bend, and reduce space, but also can weld complex components. At the same time, it has a longer life than the cable, more reliable stability, and it is not easy to break off the oxidation. It helps to improve product performance.



Disadvantages: There are many production processes for hard and soft bonded boards, which are difficult to produce and have a low yield rate. The materials and manpower are relatively large. Therefore, the prices are relatively expensive and the production cycle is relatively long.



 


4. Our company made the advantages of soft and hard board:


Has high-end production equipment, complete quality system;


Has more than 10 years of rich technology accumulation in the field of circuit boards;


We have the best process experts in the field of hard and soft bonded boards.


The core technical expert is the inventor of more than 50 invention patents;


With high-volume supply of high-end multi-layer soft and hard boards.


Plate one: soft and hard composite board


Soft board (FPC) and hard board (PCB) are glued into one body, and there is no plated hole connection at the paste place, and the number of layers is more than one layer.


 


Plate type 2: soft and hard multilayer combination board


With plated holes, more than two conductor layers.


 


 


6. Soft and hard board production process


one. Simple soft and hard board production process


Cutting → Mechanical drilling → Plated through holes → Foil → Exposure → Development → Etching → Stripping → Fake stickers → Hot pressing → Surface treatment → Processing combination → Testing → Punching → Inspection → Packaging



 


two. Multi-layer soft and hard board production process


Blanking→Prebake→Internal Graphics Transfer→Inner Pattern Etching→AOI Inspection→Laminated Inner Circuit Overlay→Punch Positioning Hole→Multilayer Lamination→Drilling Through Hole→Plasma Drilling→Metalization→ Pattern Plating→Transition of Outer Layer Pattern→Etched Outer Layer Pattern→AOI Inspection→Laminated Outer Cover Layer or Coating Protective Layer→Surface Coating→Electrical Performance Test→Outline Processing→Testing→Packing