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Through - hole Technology of PCB

Shenzhen Inno Circuit Co.,Ltd | Updated: Sep 27, 2016

   Is used as the electrical connection between the layers; the second is used as a fixed device or positioning. If the process from the process point of view, these vias are generally divided into three categories, namely, blind hole (blind via), buried hole (buried via) and through the hole (through via). The blind vias are located on the top and bottom surfaces of the printed circuit board and have a depth for the connection of the surface wiring and the underlying inner wiring. The depth of the holes does not usually exceed a certain ratio (aperture). The buried hole means a connecting hole located on the inner layer of the printed wiring board and does not extend to the surface of the circuit board. The two types of holes are located in the inner layer of the circuit board, laminated before the use of through-hole molding process to complete the formation of the hole in the process may also overlap several inner layer. The third, known as through-hole, through the entire circuit board, can be used to achieve internal interconnection or as the installation of component positioning holes. As the through-hole in the process easier to achieve, low cost, so the vast majority of printed circuit boards are using it, rather than the other two vias. The through-holes, which are not specifically described below, are considered as through-holes.