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What is the effect of heat-dissipating substrates produced by lighting circuit boards

Shenzhen Inno Circuit Co.,Ltd | Updated: Jun 08, 2018

What is the effect of heat-dissipating substrates produced by lighting circuit boards


With the popularity of high-power LEDs, the heat-dissipating substrates produced by lighting circuit boards have become mainstream LEDs. In the future, LEDs will develop toward higher brightness (ie, high power). This makes the thermal performance of the heat-dissipating substrate produced by the circuit board factory more and more prominent. Currently used for LED substrate substrates is generally referred to as "LED heat sink substrate."

       Number of layers: 2 layers Board thickness: 1.6mm Line width/Line spacing: 0.8mm/0.3mm Material: FR-4 Copper thickness: 1OZ Hole diameter: 0.6mm Process: Spray tin

       The heat-dissipating substrate produced by the lighting circuit board factory is actually derived from a conventional printed circuit board (PCB). Although there is a common aspect between them, due to the difference in application fields, it is in the product performance and process with the conventional PCB. The processing conditions and even the product structure are different. Especially the LED heat-dissipating substrate highlights its characteristics such as heat conduction and heat resistance. The heat of the chip is transmitted to the heat sink through the internal thermal path, and the heat sink dissipates heat through air convection or outward radiation. The heat-dissipating substrate produced by the circuit board factory is in the high-power LED heat-dissipation channel. The heat-dissipating substrate is a key link connecting the internal and external heat-dissipation paths, and has at least the following three functions: 1 LED chip thermal conduction and clearance; 2 LDE chip electrical connection; 3 LED chips The physical support, most of the various structural LED packages are inseparable from the heat-dissipating substrate. The heat-dissipating substrate produced by the circuit board factory has become an important component of the LDE package.

       The heat dissipation problem of the heat-dissipating substrate produced by the lighting circuit board factory directly affects the light output characteristics of the LED and the life of the device, and is a key issue in high-power LED packaging. The heat-dissipating substrate is a core component of the LED white light illumination system that connects the internal and external thermal vias, and relates to the structure and layout of the multi-chip LED package; the reliability of the LED external package. The electrical connection, physical support, heat dissipation characteristics, packaging process flow and cost of the heat-dissipating substrate LED system produced by the circuit board factory depend largely on the structure, performance, and quality of the heat-dissipating substrate.