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Copper Substrate Is A Kind Of Metal Base Plate

Shenzhen Inno Circuit Co.,Ltd | Updated: Oct 26, 2017

Copper substrate is the most expensive metal substrate, heat conduction effect than aluminum substrate and iron plate are many times better, suitable for high-frequency circuits and high and low temperature changes in the region and precision communication equipment of the heat dissipation and building decoration industry.

Copper substrate requires a large load capacity, which should be used thicker copper foil, the thickness of the general 35μm~280μm; Thermal insulating layer is the core technology of copper substrate, the core thermal conductivity of aluminium and silica fume composition and epoxy resin filled polymer composition, Small heat resistance (0.15), good viscoelastic properties, heat aging ability, Base Copper PCB can withstand mechanical and thermal stress. Copper Base plate Metal base is the supporting member of copper substrate, requirements with high thermal conductivity, is generally a copper plate, suitable for drilling, punching and cutting and other conventional machining, Base Copper PCB the metal layer (block) mainly cooling, shielding, laminating or grounding, due to the performance of copper and aluminum and the corresponding PCB machinable technology differences, Copper substrates have more performance advantages than aluminum substrates.

1, the thermal conductivity of copper base is twice times that of aluminum base, Base Copper PCB the higher the thermal conductivity, the higher the heat conduction efficiency, the better the heat dissipation performance. ,

2, the copper base can be processed into a metal hole, and the aluminum base can not, the metal hole network must be the same network, so that the signal has a good grounding performance, the second copper itself has the ability to weld, so that the design of the structure of the final installation can choose welding.

2, copper substrates can be etched with fine graphics, Base Copper PCB processing into a convex table, the components can be directly affixed to the convex platform to achieve excellent grounding and cooling effect;

3, due to the difference of elastic modulus between copper and aluminum (the elastic modulus of copper is about 121000MPa, the elastic modulus of aluminum is 72000MPa), the corresponding warpage and shrinkage of copper substrates are smaller than those of aluminum substrate, and the overall performance is more stable.

Copper substrate design rules: Since the copper base is thicker, the minimum bore diameter must be 0.4mm, line width spacing according to copper substrate on the thickness of copper foil, the thicker the thickness of copper foil, the need for the minimum width of the width, the need for the smallest spacing must be greater.

Copper substrate is a metal substrate, because of its low thermal resistance, good heat dissipation characteristics, products in a number of special industries play an important role, the base material is more suitable for cutting and punching and other conventional machining.

What are the two main advantages of copper substrate performance?

First, copper substrate material is generally based on copper, because of its cooling effect than aluminum and iron better. Thermal insulating layer is one of the core parts of copper substrate, so its copper foil thickness should be 35μm-280μm, so as to achieve strong load-carrying capacity. Compared with aluminum substrate, aluminum substrate, the main material for aluminum, its high thermal resistance, in the process of heat dissipation is not obvious, it is recommended to use copper material, so that it achieves better cooling effect, thus ensuring product stability. Material is different, so the higher the general thermal conductivity of the more in line with customer demand.

Second, the main advantages of copper substrates in the circuit components are more common substrate, because in the product power density high circuit and the circuit element more products, some substrates anti-aging ability, withstands the mechanical and the thermal stress to be unable to reach the situation, this kind of copper base board can play its good heat dissipation performance, should be the preferred substrate. If the copper substrate can be at 280 degrees high temperature does not bubble stratification, indicating a strong pressure-resistant value, does not contain heavy metal components, no pollution to the environment. Products using SMT surface mount technology, in the circuit design scheme for the heat diffusion is very effective treatment, do not need additional radiator, volume greatly reduced, greatly improved the product mechanical processing performance.