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Copper Substrates Have The Ability To Resist Thermal Aging

Shenzhen Inno Circuit Co.,Ltd | Updated: Jul 26, 2017

Copper substrate is the most expensive metal substrate, heat conduction effect than aluminum substrate and iron plate are many times better, suitable for high-frequency circuits and high and low temperature changes in the region and precision communication equipment of the heat dissipation and building decoration industry.

There are generally submerged Jintongki plate, Base Copper PCB silver-plated copper substrate, tin-sprayed copper substrate, antioxidant copper substrates.

Copper substrate circuit layer is required to have a large load flow capacity, so the use of thicker copper foil, the thickness of general 35μm~280μm; Thermal insulating layer is the core technology of copper substrate, the core thermal conductivity is composed of aluminium and silica powder, Base Copper PCB epoxy resin filled polymer, small heat resistance (0.15), excellent viscoelastic property, and can withstand mechanical and thermal stress. Copper Base plate Metal base is the supporting member of copper substrate, requiring high thermal conductivity, usually copper plate, suitable for drilling, punching and cutting and other conventional mechanical processing, the metal layer (block) mainly for cooling, shielding, laminating or grounding, Base Copper PCB because of the performance of copper and aluminum and the corresponding PCB machinable technology differences, copper substrates than aluminum substrates have more performance advantages.

The quality reliability of copper substrate is the most expensive one of the metal substrates, with the Jin YU laminated plate as the best copper substrate. The heat dissipation effect is many times better than aluminum substrate and iron-based plate, it is suitable for high frequency circuit and high and low temperature change area and the heat dissipation and building decoration industry of precision communication equipment.

There are generally submerged Jintongki plate, silver-plated copper substrate, tin-sprayed copper substrate, antioxidant copper substrates. Copper substrate copper substrate circuit layer requires a large load flow capacity, so should use thicker copper foil, the thickness of general 35μm~280μm; Base Copper PCB Thermal insulating layer is the core technology of copper substrate, the core thermal conductivity is composed of aluminium and silica powder, epoxy resin filled polymer, small heat resistance (0.15), excellent viscoelastic property, and can withstand mechanical and thermal stress. Copper substrate metal base plate is the support component of copper substrate, requires high thermal conductivity, generally is copper, also can use copper (in which copper can provide better thermal conductivity), suitable for drilling, punching and cutting and other conventional machining.