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Copper Substrates Have The Ability To Resist Thermal Aging

Shenzhen Inno Circuit Co.,Ltd | Updated: Sep 08, 2017


Copper substrate is the most expensive metal substrate, the cooling effect than aluminum substrates and iron-based plate are many times better, applicable to special products and industries.

There are generally submerged Jintongki plate, silver-plated copper substrate, Base Copper PCB tin-sprayed copper substrate, antioxidant copper substrates.

Use of copper substrates

A, copper substrate because of its low thermal resistance, viscoelastic performance, with thermal aging ability, can withstand mechanical and thermal stress, Base Copper PCB and has high thermal conductivity. These characteristics of copper substrate, exactly meet the drilling, punching and cutting and other conventional machining.

B, copper substrate is the most expensive metal substrate, the cooling effect than aluminum and iron-based plate are many times better, Base Copper PCB suitable for high-frequency circuits and high and low temperature changes in the region and precision communication equipment of the heat dissipation and building decoration industry.

The copper substrate circuit layer requires a large load carrying capacity,

Thus should use thicker copper foil,

Thickness General

35

μm~280

μm

Thermal insulating layer is the core technology of copper substrate,

It is generally composed of special ceramic powder and epoxy resin filled polymer, Base Copper PCB small thermal resistance

0.175

), the Viscoelastic property is good, has the ability of resisting thermal aging, can withstand mechanical and thermal stress. Copper substrate metal base plate is the support component of copper substrate, requires high thermal conductivity, generally is copper, also can use copper (in which copper can provide better thermal conductivity), suitable for drilling, Base Copper PCB punching and cutting and other conventional machining.

Copper substrate is a unique metal-based copper clad laminate, which has good thermal conductivity, electrical insulating properties and mechanical processing properties.

Copper substrate circuit layer requires a large load capacity, which should be used thicker copper foil, the thickness of general 35μm~280μm; Thermal insulating layer is the core technology of copper substrate, Base Copper PCB the core thermal conductivity of aluminium and silica fume composition and epoxy resin filled polymer composition, Small heat resistance (0.15), excellent viscoelastic properties, it has the ability of resisting heat aging, can withstand mechanical and thermal stress, copper base plate metal base is the support member of copper substrate, Base Copper PCB require high thermal conductivity, generally is copper, also can use copper (in which copper can provide better thermal conductivity), suitable for drilling, Punching and cutting and other conventional machining.

Performance Features: 1. Good heat dissipation. 2 Excellent insulating property. 3 good dimensional stability. 4 Good mechanical processing. 5 Shielding of electromagnetic waves. 6 Good price/performance.

Use: LED lighting circuit. 2 thick film hybrid integrated circuit. 3 power supply circuit. 4 Goodyear Relays.