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Main Properties Of Metal Substrates

Shenzhen Inno Circuit Co.,Ltd | Updated: Jun 19, 2017

Metal substrate is a kind of metal circuit board material, belonging to the electronic general element, composed of thermal insulation layer, metal plate and metal foil, has special magnetic permeability, excellent heat dissipation, high mechanical strength, good processing performance and so on.

Metal PCB substrate in the most widely used aluminum-based CCL, the product was in 1969 by the Japanese Sanyo national policy invented in 1974 began to be used in STK series power amplifier hybrid integrated circuits. The early 80s China's metal-based CCL is mainly used in military products, Metal Base PCB when the metal PCB substrate material completely dependent on imports, expensive. In the late 1980s, with the extensive use and expansion of aluminum-based CCL in automobile and motorcycle electronic products, the development of metal PCB substrate research and manufacturing technology and its application in the fields of electronics, telecommunications, power and so on The wide range of applications.

Metal PCB substrate is made of metal substrate (such as aluminum, copper, iron, silicon steel), high thermal insulation dielectric layer and copper foil composition. Insulating dielectric layer is generally made of high thermal conductivity of epoxy glass cloth adhesive sheet or high thermal conductivity of epoxy resin, Metal Base PCB insulation medium layer thickness of 80μm-100μm, metal plate thickness specifications for the 0.5 mm, 1.0mm, 1. 5 mm, 2.0 ma, 3.0 mm. Various metal substrate characteristics and application areas:

Iron-based CCL and silicon steel CCL have excellent electrical properties, magnetic permeability, pressure, substrate strength. Mainly used for brushless DC motor, tape recorders, included machine with a spindle motor and intelligent drive. But the silicon steel CCL is superior to iron-based CCL; copper-based CCL with aluminum-based CCL basic performance, the heat dissipation is better than aluminum-based CCL, the substrate can carry high current for the manufacture of power electronics and Automotive electronics and other high-power circuit with PCB, but the copper substrate density, high value, easy to oxidation, so that its application is limited, the amount is much lower than the aluminum-based CCL. 

Aluminum-based CCL has excellent electrical performance, heat dissipation, Metal Base PCB electromagnetic shielding, high pressure and bending plus q-, can be used mainly for automobiles, motorcycles, computers, home appliances, communications electronics, power electronics products. Metal PCB substrate in the aluminum-based CCL the largest market, the application examples are as follows.

Main properties of metal substrates.

4. Market Trend of Metal Substrate

With the development of electronic technology, the market demand for aluminum-based CCL is heating up, while the technical requirements for metal PCB substrate is also getting higher and higher, can be summarized as the following aspects:

A. The thermal conductivity of metal PCB substrate requirements higher;

B. Aluminum clad laminate is required to withstand higher breakdown voltages, requiring a maximum breakdown voltage of up to 15 kV (DC, AC). The 704 plant has been able to provide pressure resistant to 8 kV (AC) and 10 kV (DC) Copper cladding

C. Aluminum plate to the multi-layer development, Metal Base PCB the demand for high thermal conductivity of aluminum-based CCL sheet and supporting the thermal film.

And a method of manufacturing the same, comprising the steps of: providing a metal plate; forming an insulating dielectric layer under the metal plate; providing a substrate; forming a phase change material layer over the substrate; The substrate of the variable guide material layer is integrated with the metal plate of the insulating dielectric layer underneath. And a structure comprising: a metal plate, a dielectric layer, a substrate, Metal Base PCB a phase changing heat conductive material layer; in particular, an insulating dielectric layer provided with a metal plate thereon is sprayed or screened between the substrate and a substrate The phase change thermal conductive material layer is further integrated by pressure, and the phase change thermal conductive material layer contains epoxy resin, alumina powder, aluminum nitride powder, silicon nitride powder and graphite powder, so that the pores of the substrate can be filled and the insulation Dielectric layer and the substrate adhesion and dielectric strength, less prone to separation plate and thermal conductivity problems.