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Pcb Manufacturer PCB Design Electrostatic Analysis, Commonly Used Discharge Methods Have These

Shenzhen Inno Circuit Co.,Ltd | Updated: Jun 08, 2018

Pcb manufacturer PCB design electrostatic analysis, commonly used discharge methods have these


 Pcb manufacturer PCB design electrostatic analysis, commonly used discharge methods have these

    In the PCB board design, the ESD design of the PCB can be achieved through layering, proper placement and routing, and mounting. By adjusting the PCB layout and routing, it is possible to prevent ESD well. If possible, use multi-layer PCBs. Compared to double-sided PCBs, ground plane and power plane, as well as tightly arranged signal line-to-ground spacing can reduce common-mode impedance. Inductively coupled to make it reach 1/10 to 1/100 of a double-sided PCB. There are components for the top and bottom surfaces, with very short connection lines.


    Electrostatic discharges from the human body, the environment and even electronic equipment can cause various damages to precision semiconductor chips, such as penetrating thin insulating layers inside components; damaging the gates of MOSFETs and CMOS components; and trigger locking in CMOS devices. Short-circuit reverse-biased PN junction; short-circuit forward-biased PN junction; melting of the active device's internal solder or aluminum wire. In order to eliminate the electrostatic discharge (ESD) interference and damage to electronic devices, a variety of technical measures need to be taken to prevent them.


    In the PCB board design, the ESD design of the PCB can be achieved through layering, proper placement and routing, and mounting. In the design process, most of the design modifications can be limited to increasing or decreasing components through prediction. By adjusting the layout of the PCB, ESD can be well guarded. Here are some common precautions.


    Use multi-layer PCBs wherever possible. Compared to double-sided PCBs, ground plane and power plane, and closely spaced signal line-to-ground spacing can reduce common-mode impedance and inductive coupling to reach 1/1 of the double-sided PCB. 10 to 1/100. Place each signal layer as close as possible to a power or ground plane. For high-density PCBs with components on the top and bottom surfaces, with very short connection lines, and lots of padding, consider using inner-layer lines.


    For double-sided PCBs, tightly interwoven power and ground grids are used. The power cord is close to the ground and should be connected as much as possible between the vertical and horizontal lines or the fill area. The grid size on one side is less than or equal to 60mm. If possible, the grid size should be less than 13mm. Make sure that each circuit is as compact as possible.

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