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Performance Advantages Of Copper Substrates

Shenzhen Inno Circuit Co.,Ltd | Updated: Oct 17, 2017

Copper substrate is the most expensive metal substrate, thermal conductivity than aluminum substrate and iron plate are many times better, suitable for high-frequency circuits and high and low temperature changes in the region and precision communication equipment of the heat and Building decoration industry.

There are generally submerged Jintongki plate, Base Copper PCB silver-plated copper substrate, tin-sprayed copper substrate, antioxidant copper substrates.

Copper substrate circuit layer requires a large load capacity, which should be used thicker copper foil, the thickness of general 35μm~280μm; Thermal insulating layer is the core technology of copper substrate, the core heat conduction into Divided into aluminium and silica powder composition and epoxy resin filled polymer composition, small heat resistance (0.15), viscoelastic properties, Base Copper PCB with good anti-aging ability, can withstand mechanical and thermal stress.

Copper substrate metal base plate is a supporting member of copper substrate, requires high thermal conductivity, generally is copper, suitable for drilling, punching and cutting and other conventional machining, Base Copper PCB the metal layer (block) mainly scattered Thermal, shielding, laminating or grounding, because of the performance of copper and aluminum and the corresponding PCB machinable technology differences, copper substrates than aluminum plate has more performance advantages.

1, the thermal conductivity of copper substrate is twice times that of aluminum base, the higher the thermal conductivity, the higher the heat conduction efficiency, the better the heat dissipation performance.

2, the copper base can be processed into a metal hole, Base Copper PCB and the aluminum base can not, the metal hole of the network must be the same network, so that the signal has a good grounding performance, followed by the copper itself has the ability to weld,

So that the design of the structure of the final installation can be selected welding.

2, copper substrates can be etched with fine graphics, processing into a convex table, the components can be directly affixed to the convex platform to achieve excellent grounding and cooling effect;

3, due to the difference of elastic modulus between copper and aluminum (the elastic modulus of copper is about 121000MPa, the elastic modulus of aluminum is 72000MPa), the corresponding warpage and contraction of copper substrates are smaller than that of aluminum substrates, Base Copper PCB and the whole Body performance is more stable.

Copper substrate design rules: Because the copper base is thicker, the minimum bore diameter must be 0.4mm, line width according to copper substrate on the thickness of copper foil, Base Copper PCB the thicker the thickness of copper foil, the need for the most The wider the width of the thin line, the minimum spacing required must be greater.