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Properties Of Copper Substrates With Good Heat Dissipation

Shenzhen Inno Circuit Co.,Ltd | Updated: Sep 29, 2017



Copper substrate is a substrate with high heat dissipation, excellent dimensional stability, high mechanical strength and excellent processability. Copper substrate is the most expensive metal substrate, Base Copper PCB the cooling effect than aluminum and iron substrate are many times better, suitable for high-frequency circuits and high and low temperature changes in the region and precision communication equipment, heat dissipation and building decoration industry.

Copper substrate is a metal substrate, because of its low thermal resistance, good heat dissipation characteristics, Base Copper PCB products in a number of special industries play an important role, the base material is more suitable for cutting and punching and other conventional machining.

What are the two main advantages of copper substrate performance?

First, copper substrate material is generally based on copper, because of its cooling effect than aluminum and iron better. Thermal insulating layer is one of the core parts of copper substrate, so its copper foil thickness should be 35μm-280μm, so as to achieve strong load-carrying capacity. Compared with aluminum substrate, aluminum substrate, the main material for aluminum, Base Copper PCB its high thermal resistance, in the process of heat dissipation is not obvious, it is recommended to use copper material, so that it achieves better cooling effect, thus ensuring product stability. Material is different, so the higher the general thermal conductivity of the more in line with customer demand.

Second, the main advantages of copper substrates in the circuit components are more common substrate, because in the product power density high circuit and the circuit element more products, Base Copper PCB some substrates anti-aging ability, withstands the mechanical and the thermal stress to be unable to reach the situation, this kind of copper base board can play its good heat dissipation performance, should be the preferred substrate. If the copper substrate can be at 280 degrees high temperature does not bubble stratification, Base Copper PCB indicating a strong pressure-resistant value, does not contain heavy metal components, no pollution to the environment. Products using SMT surface mount technology, in the circuit design scheme for the heat diffusion is very effective treatment, do not need additional radiator, volume greatly reduced, greatly improved the product mechanical processing performance.