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The Copper Substrate Has The Ability To Resist Heat Aging

Shenzhen Inno Circuit Co.,Ltd | Updated: Jun 19, 2017

Copper substrate is the most expensive metal substrate, the thermal effect than the aluminum plate and the iron substrate is much better times for high-frequency circuits and high and low temperature changes in large areas and precision communications equipment, cooling and building decoration industry.

There are generally gold and copper substrate, silver-plated copper substrate, Base Copper PCB spray tin copper substrate, anti-oxidation copper substrate.

Copper substrate circuit layer requires a large current carrying capacity, which should be used thicker copper foil, the thickness of the general 35μm ~ 280μm; thermal insulation layer is the core technology of copper substrate where the core thermal conductivity of aluminum oxide and silicon powder Composition and epoxy resin filled polymer composition, thermal resistance (0.15), excellent viscoelastic properties, Base Copper PCB with the ability to resist heat aging, can withstand mechanical and thermal stress. Copper substrate metal substrate is a copper substrate support components, requiring a high thermal conductivity, generally copper, suitable for drilling, punching and cutting and other conventional machining, the metal layer (block) mainly from the heat, shielding, Grounding action, due to the performance of copper and aluminum and the corresponding PCB processing technology differences, copper substrate than aluminum plate has more performance advantages.

1, copper thermal conductivity is twice the aluminum base, Base Copper PCB the higher the thermal conductivity, the higher the heat transfer efficiency, better heat dissipation. ,

2, the copper base can be processed into a metalized hole, and the aluminum base can not, the metal hole of the network must be the same network, making the signal has a good grounding performance, followed by copper itself has weldability, making the design of the final structure of the final Installation can choose welding.

2, copper substrate copper base can be etched fine graphics, processed into a convex-like, components can be directly attached to the boss, to achieve excellent grounding and cooling effect;

3, due to the difference between the elastic modulus of copper and aluminum (copper elastic modulus of about 121000MPa, aluminum elastic modulus of 72000MPa), the corresponding copper plate warpage and expansion than the aluminum plate is small, the overall performance stable.

Copper substrate design rules: the copper base is thick, the minimum diameter of the drilling hole must be 0.4mm, line width according to the copper substrate on the thickness of the copper foil to set, Base Copper PCB the thicker the thickness of the copper, you need the most The wider the line width, the greater the minimum spacing required.