Tel: +86-755-89485443
  Request a quote

Home > News > Content
News

The Copper Substrate Has The Ability To Resist Heat Aging

Shenzhen Inno Circuit Co.,Ltd | Updated: Aug 17, 2017

Copper substrate is a high heat dissipation, excellent dimensional stability, high mechanical strength, excellent processing performance of the substrate. Copper substrate is the most expensive metal substrate, cooling effect than aluminum plate and iron substrate are many times, for high-frequency circuits and high and low temperature changes in large areas and precision communications equipment, cooling and building decoration industry.

Copper substrate is the most expensive metal substrate, the thermal effect than the aluminum plate and the iron substrate is much better times for high-frequency circuits and high and low temperature changes in large areas and precision communications equipment, Base Copper PCB cooling and building decoration industry.

Copper substrate circuit layer requires a large current carrying capacity, which should be used thicker copper foil, the thickness of the general 35μm ~ 280μm; thermal insulation layer is the core technology of copper substrate where the core thermal conductivity of aluminum oxide and silicon powder (0.15), Base Copper PCB excellent viscoelastic properties, with the ability to resist heat aging, can withstand mechanical and thermal stress. Copper substrate metal substrate is a copper substrate support components, requiring a high thermal conductivity, generally copper, Base Copper PCB can also use copper (which can provide better thermal conductivity), suitable for drilling, punching and cutting and other conventional machining The

Copper substrate is a unique metal-based CCL copper substrate, it has good thermal conductivity, electrical insulation properties and mechanical processing performance.

Copper substrate circuit layer requires a large current carrying capacity, Base Copper PCB which should be used thicker copper foil, the thickness of the general 35μm ~ 280μm; thermal insulation layer is the core technology of copper substrate where the core thermal conductivity of aluminum oxide and silicon powder (0.15), viscoelastic properties, with the ability to resist heat aging, can withstand mechanical and thermal stress, Base Copper PCB copper substrate metal substrate is a copper substrate support components, requiring a High thermal conductivity, generally copper, can also use copper (which copper plate can provide better thermal conductivity), suitable for drilling, punching and cutting and other conventional machining.

Features: 1. Good heat dissipation. 2 excellent insulation. 3 excellent dimensional stability. 4 good machinability. 5 shielding of electromagnetic waves. 6 excellent price.

Uses: LED lighting circuit. Thick film hybrid integrated circuit. 3 power supply circuit. 4 solid too relay.

Copper substrate

A, copper substrate because of its small thermal resistance, excellent viscoelastic properties, with the ability to resist heat aging, able to withstand mechanical and thermal stress, Base Copper PCB and has high thermal conductivity. Copper plate of these features, just in line with the drilling, punching and cutting and other conventional machining.

B, copper substrate is the most expensive metal substrate, heat dissipation than aluminum plate and iron substrate are many times, for high-frequency circuits and high and low temperature changes in large areas and precision communications equipment, cooling and building decoration industry.