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The Main Characteristics Of Metal Substrates

Shenzhen Inno Circuit Co.,Ltd | Updated: Jul 26, 2017

Metal base CCL is generally composed of metal substrate, insulating medium layer and conductive layer (generally copper foil) three parts, the surface of the metal substrate will be treated on one side or both sides of the insulating medium layer and copper foil, by hot-pressing composite. Because of the different structure, composition and performance of metal clad laminate, it can be divided into many kinds.

From the structure of the metal substrate, Metal Base PCB there are three kinds of common, namely metal substrate, cladding type metal substrate and metal core substrate. Metal substrates are metal plates (aluminum, copper, iron, molybdenum, etc. as the substrate, on its substrate coated with insulating medium layer and conductive layer (copper foil); coated metal substrate is six bread coated with a layer of glaze on the metal plate, Metal Base PCB sintered into one of the substrate, on this, through the screen leakage, sintering, made of conductor circuit type; Metal core substrates are generally made of copper and aluminum core materials, on its surface coated with a layer of organic polymer dielectric layer, or composite on a half cured film or pet film, coated with conductor foil ( Some use the addition of a direct form of conductive graphics, see fig. 5-1. The metal substrate is the most common, the most dosage of one.

The metal substrates can be divided into:

1 aluminum base copper clad laminate; 3 Copper base CCL;

2 iron clad laminate; 4 Molybdenum base CCL.

The properties of metal-clad laminate can be divided into:

1 General-purpose metal clad laminate; 3 high heat-resistant metal base CCL;

2 Flame-retardant metal base CCL; 4 high thermal conductivity metal base CCL;

5 ultra-high thermal conductivity metal base CCL; More than 7 layers of metal based CCL.

6 High frequency, microwave type metal base CCL;

Main properties of copper clad laminate

1 Excellent thermal performance

Metal based copper clad laminate has excellent heat dissipation performance, which is the most prominent feature of this kind of plate. With it made of PCB, can prevent the loading of the PCB on the components and the working temperature of the substrate, but also power amplifier components, high-power components, Metal Base PCB large circuit power switch and other components generated by the rapid distribution of heat. In different metal substrates, copper as the substrate for the best heat dissipation, its heat conductivity is higher than other metal substrates. Because the density of copper is large (8.9g/cm3), the price is high, Metal Base PCB easily oxidized and inconsistent and the substrate material to lightweight development trend, so not widely used. It is only used when manufacturing ultra-high heat dissipation substrates. Aluminum plate, although the heat dissipation is worse than copper plate, but much better than the iron plate, and the density of small, light (2.7g/cm3), can be antioxidant, the price is cheaper, so it is the most widely used metal-clad laminate, the largest amount of a composite plate.

The heat dissipation of metal base copper clad laminate depends mainly on the metal type of metal substrate, but also on the thickness of insulating layer and heat conductivity. In order to improve the thermal conductivity of the copper clad laminate, the heat conduction type filler should be added in the insulating layer. The thinner the insulating layer, the higher the thermal conductivity of the metal substrate, but the thinner the insulating layer, the lower the pressure resistance of the plate. Therefore, when selecting the metal base CCL, Metal Base PCB the heat conduction performance, voltage resistance and insulating property of the plate are considered.

2 Good machining performance

The metal clad laminate has high mechanical strength and toughness, which is much better than that of rigid resin clad laminate and ceramic substrate. For this purpose, a large-area PCB can be fabricated on a metal substrate. Larger weight components can be installed on such substrates. In addition, the metal substrate also has good flatness. Can be on the base plate hammer, riveting and other aspects of assembly processing. In its PCB, the wiring part can also be used for bending, distortion and other aspects of mechanical processing.

3 Excellent dimensional stability

For various CCL, there is a problem of thermal expansion (dimensional stability), especially the thickness of the plate (z-axis) of the thermal expansion, so that the metal hole, the quality of the line affected. The main reason is that the linear expansion coefficient of the plate is different, such as the Copper line expansion is 17x10-6/℃ and the line expansion coefficient of epoxy fiberglass cloth is (110~140) X10-6/℃. The difference between the two is very large, which leads to the variation of the thermal expansion of the substrate, resulting in the rupture or destruction of the copper line and the metal hole. The linear expansion coefficients of FE and Al substrates are 40x10-6/℃ and 50x10-6/℃. It is much smaller than the general resin substrate, Metal Base PCB and closer to the copper line expansion coefficient, which is conducive to ensuring the quality and reliability of the printed circuit.

4 Electromagnetic Shielding

In order to ensure the performance of electronic circuits, some components of electronic products need to prevent electromagnetic radiation, interference, Metal Base PCB metal substrates can act as shielding plate to play the role of shielding electromagnetic waves.

5 Electromagnetic properties

Base plate material of iron-based copper clad laminate is an alloy with ferromagnetic properties, such as Yongrui plate, low-carbon steel, galvanized cold-rolled steel plate, etc., the use of its characteristics to be used in tape recorder (VTR), floppy disk drive (FDD), servo motor and other small precision motor. This kind of metal base CCL is the function of the PCB, and the small motor stator base plate.